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SSD

High-speed, durable SSDs engineered for outstanding performance and long-term reliability for data-intensive applications

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  • AP923P SSD

    AP923P SSD

    PCIe Gen4x4, NVMe 2.0
    Up to 6000 MB/s Read
    Enhanced Data Security
    Learn More
    Read more
  • AP665 SSD

    AP665 SSD

    PCIe Gen3x4, NVMe 1.4
    Up to 3500 MB/s Read
    Low Power Consumption
    Learn More
    Read more
  • AP846 SSD

    AP846 SSD

    PCIe Gen4x4, NVMe 2.0
    Up to 7000 MB/s Read
    Low Power Consumption
    Learn More
    Read more
  • TGS205 SSD

    TGS205 SSD

    Wide-Temperature Operation
    Dual Power Loss Protection
    Advanced Flash Management
    Learn More
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  • TGP203 SSD

    TGP203 SSD

    PCIe Gen3x4, NVMe 1.4
    Up to 3400 MB/s Read
    Wide-Temperature Operation
    Learn More
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  • TGP205 SSD

    TGP205 SSD

    PCIe Gen3x4, NVMe 1.4
    Up to 3400 MB/s Read
    Wide-Temperature Operation
    Learn More
    Read more
  • TGS203 SSD

    TGS203 SSD

    Wide-Temperature Operation
    Dual Power Loss Protection
    Advanced Flash Management
    Learn More
    Read more
  • TGS202-P SSD

    TGS202-P SSD

    Pseudo SLC (pSLC) Technology
    Wide-Temperature Operation
    65,000 P/E Cycles
    Learn More
    Read more
  • TGS201 SSD

    TGS201 SSD

    2.5” SATA SSD
    Wide-Temperature Operation
    Advanced Data Protection
    Learn More
    Read more
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  • Products
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    • Memory Card
    • DRAM Module
    • Embedded
  • Solutions
    • Industrial regulations
      • Automotve Electronics
      • Mobie Fhone
      • Smart Wearables
      • Wireless Communication Module
      • Security Sunveilance
      • Smart Heakhcare
      • PC OEM
      • Industial Automaton
      • Network Communicatons
      • Security Sunveilance
      • Smart Heakhcare
      • PC OEM
    • Embedded
      • Smart Wearables
      • Mobie Fhone
      • Tablet
      • Wireless Communication Module
      • Commercial Display
      • Robot Vacuums
      • Recording Pen
  • Services
    • Product Services
      • FC-BGA (Flip Chip-Ball Grid Array)
      • FC-CSP (Flip Chip-Chip Scale Package)
      • WB-BGA (Wire Bonding-Ball Grid Array)
      • LGA (Land Grid Array)
      • TSOP (Thin Small Outline Package)
    • Lab Services
      • Failure Analysis
      • Environmental reliability analysis
      • Physical reliability analysis
      • Environmental testing
  • Packaging and Testing
    • System-in-Package (SiP)
      • Overview
    • Biwin’s testing process and capabilities
      • Wafer preparation stage
      • Chip interconnection and protection stage
      • Module assembly stage
      • Testing and Verification Phase
  • Consumer Storage
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    • Predator Storage
    • Acer Storage
    • Lenovo Storage
    • HP Lenovo
  • Support
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A global supplier of innovative flash storage products and solutions.Infinite Storage, Unlimited Solutions.A global supplier of innovative flash storage products and solutions.Infinite Storage, Unlimited Solutions.A global supplier of innovative flash storage products and solutions.
Infinite Storage, Unlimited Solutions.

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