High-Performance, Automotive-Grade eMMC with 3D TLC NAND, Reliable, Fast Data Storage
The BIWIN TAE208, with the eMMC 5.1 standard for automotive-grade performance, is built with high-quality 3D TLC NAND. It’s designed for a wide range of in-vehicle applications, including intelligent cockpit systems, in-vehicle infotainment (IVI), central control units, navigation, digital instrument clusters, T-BOX modules, and domain controllers.
Supporting HS400 high-speed mode, the TAE208 also features FFU, Boot Partition, RPMB, and idle data acceleration to optimize performance. Housed in a compact BGA package, the TAE208 offers capacities up to 128 GB, providing a high-density solution for space-constrained automotive designs.
To withstand the harsh conditions of vehicle environments, the TAE208 supports an operating temperature range of -40°C to +105°C, fully compliant with AEC-Q100 Grade 2 standards. The BIWIN TAE208 eMMC meets the stringent demands of automotive systems and offers an impressive combination of high endurance, low power consumption, high bandwidth, and long-term reliability.
A global supplier of innovative flash storage products and solutions.Infinite Storage, Unlimited Solutions.A global supplier of innovative flash storage products and solutions.Infinite Storage, Unlimited Solutions.A global supplier of innovative flash storage products and solutions. Infinite Storage, Unlimited Solutions.